CD8069504449801 - Intel Xeon Gold 6246R - 16-Core 32-Thread 3.40 GHz up to 4.10 GHz Turbo 35.75 MB Cache FCLGA3647 Socket P 205 W TDP DDR4-2933 Cascade Lake-R

SRGZL - Intel Xeon Gold 6246R - 16-Core 32-Thread 3.40 GHz up to 4.10 GHz Turbo 35.75 MB Cache FCLGA3647 Socket P 205 W TDP DDR4-2933 Cascade Lake-R

The Intel Xeon Gold 6246R is a 2nd Gen Xeon Scalable R refresh processor designed for dual socket servers and workstations that demand high frequency and balanced core counts. With 16 cores and 32 threads at a base frequency of 3.40 GHz and turbo boost up to 4.10 GHz, this CPU delivers exceptional performance for virtualized environments, transactional databases, AI inference, and HPC workloads. It supports DDR4 2933 ECC memory across six channels per socket, Intel Optane Persistent Memory, and advanced security features, making it a reliable choice for mission critical deployments.

Technical Specifications

• sSpec: SRGZL
• Ordering Code Tray: CD8069504449801
• Microarchitecture: Cascade Lake R 2nd Gen Xeon Scalable Refresh
• Cores Threads: 16 32
• Base Frequency: 3.40 GHz
• Max Turbo Frequency: 4.10 GHz
• Cache: 35.75 MB Intel Smart Cache
• Socket: FCLGA3647 Socket P
• UPI Links: 2 links at 10.4 GT s
• TDP: 205 W
• Max Memory Speed: DDR4 2933 MT s
• Memory Channels: 6
• Max Memory Capacity per CPU: 1 TB with RDIMM or LRDIMM platform dependent
• PCIe Lanes: 48 PCIe 3.0
• Instruction Set Extensions: AVX AVX2 AVX 512 SSE4.2
• Virtualization Features: Intel VT x VT d EPT
• Security Features: Intel TXT AES NI MBEC Run Sure

Key Features

• ☑ High clock frequency for strong per core performance with 16 cores 32 threads
• ☑ 6 channel DDR4 2933 memory support with ECC and Optane PMem
• ☑ Designed for dual socket scalability with 48 PCIe 3.0 lanes and 2 UPI links
• ☑ Advanced AVX 512 instructions for HPC analytics and AI inference
• ☑ Enterprise grade features including VT d TXT and Intel Run Sure technologies

✅ Confirmed Compatibility

Please note that the following list is not exhaustive. Compatibility depends on the motherboard’s BIOS version and chipset support. It’s essential to verify compatibility with the motherboard manufacturer.

Motherboards LGA3647 Intel C62x

✔ Supermicro: X11DPi N X11DPi NT X11DPH I X11DPH TN X11DPH TLN4F X11DSN TSQ requires BIOS 3.0a or newer for Cascade Lake R support
✔ ASUS: Pro WS C621 64L SAGE 10G Z11PA D8 and C621 series boards with latest BIOS updates
✔ Intel Server Board: S2600WF family including WFR WF0R WFTR validated for 2nd Gen Xeon Scalable up to 205 W
✔ Gigabyte Server: MD71 HK0 MD61 S3 series with Cascade Lake BIOS microcode support and thermal solutions for 205 W CPUs
✔ Tyan: S7067 S7076 C621 based systems with Cascade Lake firmware updates and high performance heatsinks

Servers and Systems Dual Socket LGA3647

✔ Dell PowerEdge: R640 R740 R740xd T640 FC640 M640 MX740c with latest iDRAC BIOS firmware kits rated for 205 W CPUs
✔ HPE ProLiant Gen10: DL360 Gen10 DL380 Gen10 validated for 6246R via CPU enablement kits and ROM iLO updates
✔ Lenovo ThinkSystem: SR650 SR630 requires correct thermal options ambient ≤30 C and validated firmware for 205 W
✔ Cisco UCS M5: C220 M5 C240 M5 B200 M5 with UCS Manager firmware including Cascade Lake support
✔ Supermicro: 1U and 2U X11D series such as 2029P 6029P 1029P with SNK P0064AP4 or equivalent heatsinks
✔ Intel Systems: S2600WF chassis platforms designed for 2nd Gen Xeon Scalable CPUs and 205 W TDP

Not Compatible

✔ LGA2066 Xeon W Core X platforms
✔ LGA4189 Ice Lake and Sapphire Rapids systems
✔ Any 1st Gen LGA3647 systems without BIOS updates for 2nd Gen Cascade Lake R

Interchange and Identification

• Family: Xeon Gold 6200R Series
• sSpec: SRGZL
• Ordering Code Tray: CD8069504449801

• OEM CPU Kits:

• Dell: 338 BVKM and similar CPU upgrade kits
• HPE: DL360 DL380 Gen10 CPU kits with heatsink bracket screws
• Lenovo: FRU CPU kits for SR650 SR630 with heatsink brackets
• Supermicro: High performance heatsinks such as SNK P0064AP4 validated for 205 W

Quick Install Checklist

• Update BIOS UEFI BMC iDRAC iLO UCS CIMC to current firmware before install
• Confirm chassis and VRM support for 205 W TDP CPUs install the correct heatsink
• In dual socket configurations both processors must be identical in model stepping and sSpec
• Populate DIMMs evenly across 6 channels per CPU for full bandwidth and maximum frequency
• Validate Optane Persistent Memory support if required follow system vendor placement rules