2GB-PC2-3200R-2RX4 - 2GB 400MHz DDR2 ECC Registered 2Rx4 240-Pin Server Memory

This 2GB PC2-3200R server memory module is a 240-pin DDR2-400 ECC Registered RDIMM built in the exact 2Rx4 organization with two ranks of x4-width DRAM devices. It operates at 400 MT/s, commonly listed as 400MHz, and 1.8V for compatible legacy servers, workstations, blade systems, and active memory-card assemblies requiring 2GB dual-rank x4 Registered memory. The manufacturer and PCB revision may vary, but every module supplied with this item will be 2Rx4.

Technical Specifications

• Primary Part Number: 2GB-PC2-3200R-2RX4
• Product Type: DDR2 ECC Registered 2Rx4 server memory module
• Capacity: 2GB / 2048MB
• Quantity Included: One memory module
• Memory Technology: DDR2 SDRAM
• JEDEC Speed Class: DDR2-400 / PC2-3200R
• Effective Data Rate: 400 MT/s, commonly listed as 400MHz
• Memory Clock: 200MHz
• Peak Module Bandwidth: 3.2GB/s / 3200MB/s
• Form Factor: Standard 240-pin Registered DIMM
• Buffering: Registered address and command signals with an onboard register and clock PLL
• ECC Width: 72 bits total, consisting of 64 data bits and 8 ECC check bits
• Module Organization: 256M x 72
• Exact Rank / DRAM Organization: 2Rx4
• Rank Count: Two ranks
• DRAM Device Width: x4
• Electrical Loading: Two rank loads per module
• Common Device Construction: 36 512-megabit x4 DRAM devices across two ranks; stacked-package and PCB layouts vary by revision
• Nominal Voltage: 1.8V
• CAS Latency: CL3 at DDR2-400
• Common Rated Timing: 3-3-3
• Clock Cycle Time: 5.0ns
• Typical tRCD / tRP: 15ns / 15ns
• Burst Length: 4 or 8
• Module Features: Serial Presence Detect EEPROM, on-die termination, 4-bit prefetch architecture, and registered address/control signaling
• Common JEDEC Label: PC2-3200R-333-11 or PC2-3200R-333-12, depending on SPD and raw-card revision
• Common Module Width: Approximately 133.35mm
• Common Low-Profile Height: Approximately 30mm; PCB thickness, stacked-device clearance, and overall height vary by manufacturer revision
• Primary Application: Systems specifically supporting 2GB 240-pin DDR2-400 ECC Registered 2Rx4 RDIMMs
• Manufacturer: Varies by available inventory; every supplied module will meet the listed 2Rx4 specification

The 333 field in a PC2-3200R-333 label represents the CL-tRCD-tRP timing set of 3-3-3. It does not change the module's DDR2-400 / 400 MT/s speed rating. The x4 device width can participate in controller-dependent enhanced error protection, but that capability depends on the complete system and memory population.

Interchangeable / Replacement Part Numbers

The following references identify 2GB DDR2-400 ECC Registered modules with a 2Rx4 organization. When replacing memory in an existing pair or bank, match the installed part number whenever possible.

HYMP525R72BP4-E3, M393T5750BS0-CCC, M393T5750BY0-CCC, M393T5750CZA-CCC, M393T5750CZ0-CCC, M393T5750CZ3-CCC, HYS72T256020HR-5-A, HYS72T256220HR-5-A, HYS72T256220HR-5-B, MT36HTF25672Y-40EB1, EBE21RD4AGFA-4A-E, EBE21RD4AGFB-4A-E, NT2GT72U4NA0BU-5A, NT2GT72U4NA0BV-5A, NT2GT72U4NA1BV-5A, DTM63309A, DTM63309B, DTM63309F, DTM63309J, SB2567RDR212835IA, SG2567RDR212835IA, SG2567RDR212435IB, SG2567RDR212435NB, SG2567RDR212435SE, 75.A72A1.G00, B527M4C2BJA-50, INT72P4M256M8M-A05AYU, KVR400D2D4R3/2GI, NLD257D21203F-D32KIB, S525672M20A-50A, T400RB2G4/S2GTR4CHS, 39M5810, 39M5811, 73P2871

Dual-Rank Cross-References - 2Rx4 Confirmation Required

345114-051, 345114-851, 378021-001, 413387-001

These service references identify 2GB dual-rank PC2-3200 modules, but the service number alone does not establish x4 organization. Use one of these references with this item only when the module label or SPD data also confirms 2Rx4.

Two-Module Kit Cross-References

4GB Dual-Rank Kit Reference - 2Rx4 Confirmation Required: 375004-B21

4GB 2Rx4 Kit References: 39M5812, 73P2867

Each kit number above represents two 2GB dual-rank modules. For 375004-B21, confirm that each included module is marked 2Rx4 or reports 2Rx4 through SPD data. This item includes one 2GB module per quantity ordered; order two modules when your system requires a matched pair.

Important Compatibility Requirement

The module supplied will have a 2Rx4 organization. A 1Rx4, 2Rx8, or 1Rx8 module is not interchangeable solely because it has the same 2GB capacity, DDR2-400 speed, 240-pin connector, and PC2-3200R label. If your system requires a specific manufacturer part number or service label, match that reference exactly before ordering.

✅ Confirmed Compatibility

Compatibility applies specifically to 2Rx4 modules. Two ranks create two electrical loads, so dual-rank population limits and slot order must be followed. Use identical modules within every required pair or bank, and match the manufacturer or service part number when required. Similar model names can use different motherboard revisions or memory technologies, so verify the complete system model before ordering.

✔️ ProLiant DL380 G4: Supports the 375004-B21 two-module dual-rank kit; install the dual-rank bank first, follow the supported bank combinations, and note that online-spare memory is unavailable when this kit is installed
✔️ ProLiant DL580 G3: Supports the 375004-B21 dual-rank kit in two-module banks on compatible memory boards; modules within each bank must match, and the memory-board population requirements for the selected protection mode must be followed
✔️ ProLiant ML350 G4p: Supports the 375004-B21 dual-rank kit in identical interleaved pairs; populate bank A first and place a dual-rank bank ahead of supported single-rank banks
✔️ ProLiant ML570 G3: Supports the 375004-B21 dual-rank kit on compatible memory boards; install identical pairs, follow the board load limits, and use the exact memory-board sequence for the selected redundancy mode
✔️ eServer xSeries 226 Types 8488 and 8648: Uses the 39M5811 or 73P2871 dual-rank x4 family in matched pairs
✔️ eServer xSeries 260: Uses the 39M5811 or 73P2871 dual-rank x4 family; install the modules in the documented memory-card pair sequence
✔️ eServer xSeries 366: Uses the 39M5811 or 73P2871 dual-rank x4 family on a supported active-memory card; complete the required matched pair or bank
✔️ eServer xSeries 460 and MXE 460: Use the 39M5811 or 73P2871 dual-rank x4 family on supported four-slot DDR2 memory cards; follow the card-pair and bank-order requirements
✔️ System x3800 Types 8865 and 8866: Use the 39M5811 dual-rank x4 family on supported four-slot DDR2 memory cards; populate the prescribed matched pair
✔️ System x3850 Types 8864, 8863, and 7362: Use the 39M5811 dual-rank x4 family on supported active-memory cards; modules of the same capacity are installed in matched pairs and memory cards follow the system sequence
✔️ System x3950 and x3950 E Types 8872, 7363, 8874, 7364, 8878, and 8879: Use the 39M5811 dual-rank x4 family on the supported scalability or memory-card assembly; install matched pairs in the documented order
✔️ BladeCenter HS20 Types 8843 and 1883: Uses the 39M5811 individual module or 39M5812 two-module kit and requires matched 2Rx4 pairs
✔️ IntelliStation Z Pro Type 6223: Supports the 39M5811 or 73P2871 dual-rank x4 family; follow the exact system-model configuration and pairing rules
Intel Server Boards and Systems
✔️ Intel Server Board SE7520BB2: Compatible 2GB 2Rx4 references include M393T5750CZ0-CCC, M393T5750CZ3-CCC, HYS72T256220HR-5-A, MT36HTF25672Y-40EB1, DTM63309F, B527M4C2BJA-50, and KVR400D2D4R3/2GI; identical modules are required within each bank
✔️ Intel Server Boards SE7520BD2SCSID2, SE7520BD2SATAD2, and SE7520BD2VD2: Support compatible 2GB 2Rx4 DDR2-400 modules in identical bank pairs; begin with the bank farthest from the memory controller, install single-rank banks before dual-rank banks in mixed configurations, and limit an all-dual-rank configuration to four DIMMs
✔️ Intel Server Board SE7320VP2D2: Supports compatible 2GB 2Rx4 PC2-3200 modules in identical pairs; dual-rank modules are populated before single-rank modules, and an all-dual-rank installation is limited to four DIMMs
✔️ Intel Server Boards SE7520JR2SCSID2 and SE7520JR2SATAD2: Support 2GB x4 dual-rank DDR2-400 Registered ECC modules in identical bank pairs; dual-rank modules are installed before single-rank modules, with no more than four dual-rank DIMMs

☑️ Key Features

☑️ Guaranteed 2Rx4 organization with two ranks of x4-width DRAM devices
☑️ Two ranks and x4 DRAM width are documented separately from 1Rx4 and 2Rx8 alternatives
☑️ x4 DRAM organization supports the enhanced error-protection modes offered by compatible controllers when the complete memory configuration meets platform rules
☑️ 2GB capacity in a standard 240-pin DDR2 Registered DIMM form factor
☑️ DDR2-400 transfer rate with up to 3.2GB/s of peak bandwidth per module
☑️ ECC x72 organization supplies eight check bits to compatible error-correcting memory controllers
☑️ Registered address and command signaling supports compatible multi-DIMM server configurations
☑️ One 2GB module is included per quantity ordered

⚙️ Fit Notes

• Confirm that the installed module label or SPD data identifies 2Rx4. Do not infer rank solely from the number of visible packages because stacked-device module layouts vary.
• This module is not an automatic replacement for 1Rx4, 2Rx8, or 1Rx8 memory. Capacity and PC2-3200R speed do not erase rank-count or DRAM-width requirements.
• Confirm that the system requires a 240-pin DDR2 ECC Registered RDIMM. It is not interchangeable with an unbuffered DIMM, a fully buffered DIMM, DDR or DDR3 memory, or a 200-pin DDR2 SO-DIMM.
• One module is included. Many compatible systems require identical pairs, full banks, or complete memory-card sets, so order the quantity required by the service manual.
• A 2Rx4 module creates two electrical rank loads. Some compatible boards accept fewer dual-rank modules than single-rank modules even though more physical slots are present.
• When replacing one module in an existing pair or bank, match the manufacturer part number, 2Rx4 organization, capacity, speed, and timing whenever possible.
• Follow rank order exactly. Several compatible systems require dual-rank banks to be installed before single-rank banks, and some limit the number of populated dual-rank banks or DIMMs.
• The x4 construction can enable controller-dependent Chipkill or similar device-level correction, but the module alone does not guarantee that feature. Every installed module, the memory controller, firmware, and population mode must support it.
• Stacked-device revisions can have greater height or different thermal behavior than standard low-profile modules. Confirm chassis and memory-card clearance before ordering a particular revision.
• The 400MHz wording used in listings refers to the 400 MT/s effective DDR data rate; the physical memory clock is 200MHz.