Shin-Etsu G751 - Microsi High Performance Thermal Grease / Thermal Paste for CPU Processors or GPU's

Shin-Etsu G751 Microsi High Performance Thermal Grease Thermal Paste For CPU Processors Or GPUs

This is 100% original Shin-Etsu G751 high-performance silicone thermal grease, packaged by Microsi and widely used by major OEMs for factory CPU and GPU installs. It’s designed for demanding thermal applications such as processors, graphics chips, northbridge / southbridge chipsets, and high-power ICs where long-term reliability and low thermal resistance are critical. Shin-Etsu G751 is a premium, silicone-based thermal compound engineered to provide high thermal conductivity with extremely low bleed and evaporation. Because it is non-curing and stable at elevated temperatures, it maintains consistent performance over long service intervals without drying out like many generic pastes.

Each syringe contains approximately 0.5g of gray thermal grease, enough for multiple CPU/GPU applications when applied correctly. The slim injector tube makes it easy to control bead size for desktop, laptop, workstation, server, and industrial applications.

For best results, we strongly recommend pairing this thermal grease with CP400 – Chemtronics Chempad Presaturated Alcohol Wipe Cleaning Pad (sold separately) to properly clean old compound from heatsinks and processor lids before re-application:
https://www.cpumedics.com/cp400-chemtronics-chempad-presaturated-alcohol-wipe-cleaning-pad/

Technical Specifications

• Product Name: Shin-Etsu G751 high performance silicone thermal grease
• Manufacturer: Shin-Etsu
• Distributor / Packaging: Microsi
• Type: Non-curing silicone-based thermal compound
• Color: Gray paste
• Package Type: Injector / syringe
• Syringe Dimensions: Approx. 110 mm x 8 mm x 8 mm (L x W x H)
• Net Amount: ~0.5 g per syringe

Material & Performance Properties (typical):

• Viscosity at 25°C: ~3500 P
• Specific Gravity at 25°C: ~2.5
• Bleed (24 hrs @ 150°C): < 0.1%
• Volatile Content (24 hrs @ 150°C): < 0.3%
• Thermal Conductivity: > 4.5 W/m·K (high performance class)

Manufacturer datasheet for detailed technical data:
https://www.microsi.com/wp-content/uploads/2016/09/G751TDS-9202016.pdf

Interchangeable / Replacement Part Numbers

• Shin-Etsu G751
• Shin-Etsu G-751 (alternate notation)
• Microsi Shin-Etsu G751 syringe

(All of the above refer to the same Shin-Etsu G751 thermal compound in syringe packaging.)

✅ Confirmed Compatibility

Please note that the following list is not exhaustive. Compatibility depends on your system's specific configuration and thermal design. It's essential to verify suitability with your system or heatsink manufacturer prior to installation.

✔️ Desktop CPUs: Intel and AMD processor lids (heatspreaders) across multiple generations
✔️ Laptop CPUs / APUs: Mobile Intel and AMD processors in notebooks and ultrabooks
✔️ GPUs: Discrete NVIDIA and AMD graphic chips (desktop cards and notebook dGPUs)
✔️ Motherboard Chipsets: Northbridge / southbridge / PCH / VRM components with heatsinks
✔️ Game Consoles: CPU/GPU packages in consoles where a paste-type compound is specified
✔️ Workstations & Servers: Xeon, EPYC and other high-power CPUs with metal heatspreaders
✔️ Industrial / Embedded: Fanuc, CNC controllers, PLCs, industrial PCs, and other high-density electronics using heatsinks and heat spreaders

☑️ Key Features

☑️ OEM-grade performance – commonly used by major system manufacturers on CPUs and GPUs
☑️ High thermal conductivity (>4.5 W/m·K) for excellent heat transfer from die to heatsink
☑️ Low bleed and low volatility – maintains consistency at elevated temperatures over time
☑️ Non-curing silicone base – stays workable, does not harden or crack with normal use
☑️ Easy syringe application – precise and clean installation even in tight notebook layouts
☑️ Broad application range – suitable for desktop, laptop, workstation, server, and industrial equipment
☑️ Available in bulk – ideal for repair shops, refurbishers, and production or rework environments

⚙️ Fit Notes

• Surface preparation: Always remove the old thermal material completely before applying G751. For best results, use CP400 – Chemtronics Chempad Presaturated Alcohol Wipe Cleaning Pad to clean the CPU/GPU heatspreader and heatsink surface:
• https://www.cpumedics.com/cp400-chemtronics-chempad-presaturated-alcohol-wipe-cleaning-pad/
• Application amount: Apply a small pea-sized or thin line of compound to the center of the CPU/GPU heatspreader. When the heatsink is mounted and tightened evenly, the paste will spread to form a uniform, thin layer.
• Contact surfaces: Designed for metal-to-metal or metal-to-ceramic interfaces (e.g., IHS to heatsink base). Do not apply on exposed electrical contacts or use as an adhesive.
• Mixing compounds: For consistent performance, avoid mixing G751 with other thermal compounds. Fully clean old paste before switching to Shin-Etsu G751.
• Storage: Keep syringes capped when not in use. Store in a cool, dry place away from direct sunlight to maintain optimal viscosity and shelf life.
• Bulk / volume users: If you are a repair center, refurbisher, or OEM and need large quantities, this product is well-suited for repeated use across many systems. One 0.5 g syringe can service multiple CPUs or GPUs when applied in a thin, proper layer.